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[内存] AMD Details Carrizo APUs Energy Efficient Design at Hot Chips 2015 – 28nm

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发表于 2015-8-26 16:36:15 | 显示全部楼层 |阅读模式

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[size=21.6000003814697px]AMD Details Carrizo APUs Energy Efficient Design at Hot Chips 2015 – 28nm Bulk High Density Design With 3.1 Billion Transistors, 250mm2 Die[size=21.6000003814697px]

Read more: http://wccftech.com/amd-carrizo-apu-architecture-hot-chips/#ixzz3juLiq4xA


[size=21.6000003814697px]AMD announced their 6th generation Carrizo APU platform three months ago at Computex 2015. During the launch, we did a very brief technical analysis of the new Carrizo APU design but AMD has offered even more information regarding Carrizo at their Hot Chips 2015 presentation which has a energy efficient design on the Carrizo APU, built on a 28nm process.
[size=21.6000003814697px]
AMD’s 6th Generation Carrizo APUs Officially Launched and Detailed
[size=21.6000003814697px]When talking about basic features, first of all, we should know that Carrizo is based on the 28nm process node and comes in the FP4 package. The Carrizo chips feature 4 x86 Excavator cores with 2 MB L2 cache, 3rd generation GCN GPU (integrated) that pack 8 graphics compute units or 512 stream processors and 2 RBs. The chips support DDR3 dual channel memory with speeds of up to 2133 MHz and are designed to feature full support for HSA 1.0 spec. The chips also integrate the southbridge on die and have several I/O technologies along with new software tier support that we will detail in just a bit.
[size=21.6000003814697px]The Carrizo AP features a nominal 5-15% IPC gains from the new Excavator cores which shows AMD is following Intel footsteps in this field with the blue team also offering a similar IPC improvement on their latest 14nm Broadwell Uarch while focusing on energy efficiency to make their designs more compatible with efficient PCs and low power solutions. AMD used the 28nm Bulk High Density node to build Carrizo and has managed to optimize the overall chip design by adding 29% more transistors than Kaveri making it more denser, thanks to the high-density design library. This results in a 3.1 Billion transistor die that delivers 40% lesser power consumption and 23% lesser die area than its predecessor.
[size=21.6000003814697px]


[size=21.6000003814697px]The AMD Carrizo APU packs 12 compute cores which are a combination of the CPU and GPU cores that are geared towards compute and work in harmony with the HSA 2.0 architecture. There are up to four x86 Excavator cores and 8 CU GPU core (64 stream processors per CU). The H.265 encode support allows 3.5 times transcode performance of Kaveri while the compute architecture enables the 8 GCN compute units (512 stream processors) a reduction of 20% in power consumption. The SOC design offers up to 3 display heads with the ability to operate on 4K (UHD) resolution, and featuring a separate integrated security co-processor.
[size=21.6000003814697px]When specifically talking about Excavator cores, we get improved and larger cache sizes that allow prefetch improvements and lower latency. Better branch prediction leads to 50% increase in branch target buffer size (512 to 768 Entry)) and accelerated flush in the FPU. New instruction support include AVX2, MOVBE, SMEP and BMI1/2 along with more power gating options to cut down power when the chip remains dormant or doesn’t gets utilized to full extent. The most significant gains in frequency come to 15W models while the 35W models actually able to push IPC with and 0-5% clock speed bumps. The 15W variants get a 25-45% frequency push and increase in IPC by 10%.
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In terms of size, the Carrizo die measures at 250.04mm2 on the 28nm  BHD node while Kaveri measures at 245mm2 on the same process. The difference between both chips is that Carrizo ups the transistor count to 3.1 billion from Kaveri’s 2.41 billion count. The sudden reduction in the size of the die even when adding more better x86 performance was due to the fact that Excavator cores are smaller than Steamroller cores, measuring at just 14.48mm2 with a core transistor count of 102 million transistors. The L1 cache has also doubled on Carrizo to 32 KB per core from 16 KB. The overall core structure has 690 million transistors crammed in one partition while the rest of the transistors are dedicated to GCN cores that utilize HSA and compute engine advantage in general purpose computing environments.
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 楼主| 发表于 2015-8-26 16:37:15 | 显示全部楼层
冶天:全整合的硬件方式,我翻译不了.大家看图的指向性,召唤@包子侯爵 这条必须翻译.

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 楼主| 发表于 2015-8-26 16:37:47 | 显示全部楼层
A家召唤术@幽幽子 @gby4411 @owen @沉默の天才 @goodcup @Mcisu萌 @WzHua @远古装机猿 @liuwei88 @处暑 @margu_168 @z23wen @Daten89 @DKsacred @Ecthellin @mang @冰夷流云 @该隐的复仇 @PPT大法好@远古装机猿 @老游 @i3默秒全 @拜占廷查士丁尼 @FURY雷霆@Radeon @AMD

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发表于 2015-8-26 20:39:52 | 显示全部楼层
我是文盲,我看不懂啊
葵花在手,啊哈哈哈哈哈哈!
江山我有,啊哈哈哈哈哈哈!

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 楼主| 发表于 2015-8-26 20:49:13 | 显示全部楼层
z23wen 发表于 2015-8-26 20:39
我是文盲,我看不懂啊

http://tieba.baidu.com/p/4000734779 看图脑补

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发表于 2015-8-27 08:46:14 | 显示全部楼层
还是看不懂啊
葵花在手,啊哈哈哈哈哈哈!
江山我有,啊哈哈哈哈哈哈!

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 楼主| 发表于 2015-8-27 09:54:55 | 显示全部楼层

就是哪里输入哪里输出
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