[新架构]AMD正式取消对于20纳米的芯片开发，自掏腰包3300万刀

包子侯爵 · 发表于 2015-7-8 23:25:31

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本帖最后由包子侯爵于 2015-7-8 23:25 编辑

Title：AMD Migrates 20nm Chips In Development to FinFET – Pays $33 Million Charge
From:http://wccftech.com/amd-transitions-20nm-designs-finfet/

AMD has announced that it will be transitioning all of its 20nm chip designs to FinFET in its updated financial guidance statement published yesterday. AMD had previously stated that it will be launching 20nm products this year. This included AMD’s Sky Bridge platform APUs which promised to feature both x86 and ARM variants that were not only socket compatible but pin-to-pin compatible as well.

AMD已经在昨天的公司财务指导上宣布，将放弃20纳米芯片的设计，转投FinFET。AMD此前表示要在今年推出20纳米产品。包括兼容x86和ARM底座的Sky Bridge系列APU。

There were also rumors last year that AMD would be shrinking the console chips to from 28nm to the 20nm process this year. However AMD’s statement yesterday confirms that the company will be migrating 20nm products to a leading edge FinFET node.

去年也有传闻说AMD会在今年从28纳米转投20纳米工艺。不过AMD昨天的说法证实公司将会将20纳米产品转移到FinFETal上。

AMD Migrates 20nm Chips In Development to FinFET – Pays $33 Million Charge

AMD抛弃20纳米转投FinFET –花费330万美元

AMD has yet to specify which FinFET process it’s talking about. Whether it’s referring to the common 14nm process node of the Globalfoundries Samsung partnership i.e. 14nm FinFET ( 14LPE and 14LPP ) or TSMC’s 16nm FinFET ( 16FF and 16FF+ ) is yet to be confirmed.

AMD还没有确定FinFET的具体工艺。无论是GF还是三星的14纳米FinFETal( 14LPE和14LPP ) 还是台积电的16纳米FinFET ( 16FF和16FF+ )哪一家的技术会被使用都未得到证实。

The company started several product designs in 20nm that will instead transition to the leading-edge FinFET node.

公司开始设计几款20纳米产品，而不是过渡到FinFETal工艺。

AMD has several FinFET based products planned for release in 2016. Including an updated enthusiast line of FX CPUs based on the all new high performance x86 core code named “Zen” . Which is estimated to deliver a 40% improvement in IPC over its predecessor, Excavator as well as introduce simultaneous multi-threading technology for the first time in an AMD x86 CPU core. In addition to Zen, AMD has announced a new graphics architecture that will debut next year on FinFET as well. With up to twice the power efficiency of AMD’s current 1.2 iteration of the GCN graphics architecture found in AMD’s latest Fiji GPU powering the R9 Fury line of enthusiast graphics cards and the Tonga GPU powering AMD’s R9 380 graphics card.

AMD已经打算在2016年发布几款FinFETal产品。包括在FX系列CPU基础上高性能x86处理器Zen。Zen被估计会比之前的IPC有40%提升，同时也是首次在x86CPU上引入同步多线程技术。除了Zend，AMD也宣布了在明年基于FinFETal的新图新架构。拥有比AMD现在的GCN 1.2显卡（在AMD最新的Fiji核心上（R9 Fury产品线上）和Tonga核心上（R9 380））2倍的电源效率。

The company did not name its upcoming FinFET based graphics architecture, but numerous leaks suggest that it’s code named “Arctic Islands” and “Greenland” will be its flagship. These GPUs will feature second generation stacked High Bandwidth memory and the code name was apparently chosen to reflect the significant power efficiency gains that the company is anticipating from these new chips.

公司目前还没有透露即将推出的FinFETal架构的图形核心。但是从内部透露的消息来看，新旗舰的命名可能是 “Arctic Islands”和“Greenland” （“北极群岛”和“格陵兰岛”）。这些新的GPU将采用第二代HBM显存，这带HBM拥有显著的电源效率提升，所以公司也非常期待新芯片。

The confirmation of moving the company’s existing in-house 20nm chip design plans to 16nm came with a $33 million charge reflected in the company’s revised 2015 Q2 earnings guidance published yesterday. AMD’s revised forecast guides revenue down from the previous 3% plus or minus 3% to a fixed 8% figure. Interestingly the decline according to the company was not due to the channel, which it states is returning to a more healthy state of being. The sharp decline is blamed on largely soft OEM APU sales that missed previous estimates.

确认公司显存的20纳米设计转向16纳米的消息可以从昨天发布的2015财年第二季度的财务报表里看到，有一笔3300万刀的费用。AMD的修订预测收入从之前的正负3%固定至8%。更有趣的是，公司的业绩下滑不是因为趋势如此，而是久违的健康状态。业绩的下滑很大程度上贵久违软OEM APU的销量低于预期。

SUNNYVALE, CA — (Marketwired) — 07/06/15 — AMD (NASDAQ: AMD) today announced that revenue for the second quarter ended June 27, 2015 is expected to be lower than previously guided. The company now expects second quarter revenue to decrease approximately 8 percent sequentially, compared to the previous guidance of down 3 percent, plus or minus 3 percent. The sequential decrease is primarily due to weaker than expected consumer PC demand impacting the company’s Original Equipment Manufacturer (OEM) APU sales. The company expects second quarter channel sales and channel inventory reduction efforts to be in-line with the company’s plans.

The company anticipates non-GAAP gross margin to be approximately 28 percent, compared to the previous non-GAAP guidance of approximately 32 percent primarily due to a higher mix of Enterprise, Embedded and Semi-Custom segment sales and lower than anticipated Computing and Graphics segment APU unit volumes due to weaker than expected OEM PC product demand. Additionally the company anticipates GAAP gross margin to be further impacted by a one-time charge of approximately $33 million associated with a technology node transition from 20 nanometer (nm) to FinFET. The company started several product designs in 20nm that will instead transition to the leading-edge FinFET node.

Cash and cash equivalents at the end of the second quarter are expected to be approximately $830 million, in line with expectations.

AMD will report second quarter 2015 results after market close on Thursday, July 16, 2015. AMD will hold a conference call for the financial community at 2:30 p.m. PT (5:30 p.m. ET) that day to discuss second quarter financial results and to provide information regarding expected third quarter results. AMD will provide a real-time audio broadcast of the teleconference on the Investor Relations page at http://www.amd.com. The webcast will be available for 10 days after the conference call.

该部分机翻（与主题文章无关，是相关阅读材料）。加利福尼亚州桑尼维尔 - （Marketwired） - 15年7月6日 - AMD公司（纳斯达克股票代码：AMD）今天宣布，预计收入在截至2015年6月27日的第二季度低于此前指导。该公司目前预计第二季度营收将比上一季度下滑8％左右，相比下降了3％以前的指导下，正负3％。环比下降主要是由于高于预期的消费者PC需求影响公司的原始设备制造商（OEM）销售APU较弱。该公司预计第二季度的渠道销售和渠道库存减少的努力，在网上与该公司的计划。

该公司预计非美国通用会计准则毛利率为28％左右，相比大约32％，这主要是由于企业提出了更高的混合先前的非美国通用会计准则的指导，嵌入式和半定制业务销售额比预期的计算和图形低段APU出货量，由于高于预期的OEM PC产品的需求减弱。此外，该公司预计GAAP毛利率将进一步与20纳米（nm）到一个的FinFET技术节点过渡相关的近3300万美元的一次性费用的影响。公司起步于20nm的多个产品的设计，而不是将过渡到前沿的FinFET节点。

在第二季度末现金及现金等价物预计约为8.3亿美元，符合预期。

2015年的结果上周四，7月16日股市收盘后，AMD将公布第二季度，AMD公司2015年将举行电话会议金融界下午2:30 PT（下午5:30 ET）的那一天，讨论第二季度的财务业绩和提供有关预期的第三季度业绩信息。 AMD将提供投资者关系网页上的电话会议的实时音频广播在http://www.amd.com。该网络广播可在电话会议结束后10天。

Title:AMD officially cancels 20nm chips, takes $33 million charge
From:http://www.kitguru.net/component ... -33-million-charge/

Advanced Micro Devices this week formally confirmed that it would not produce any of its chips using 20nm process technology at Taiwan Semiconductor Manufacturing Co. Instead, the company will focus on development of its chips to be made using various FinFET process technologies. As a result of the cancellation, the company took $33 million charge.

AMD本周正式确认将不会使用台积电的任何20纳米技术。取而代之，公司将会专注于用FinFET技术制造芯片，因此取消订单花费了3300万刀。

AMD officially announced two new system-on-chips processors code-named “Amur” (featuring ARMv8-A cores) and “Nolan” (featuring Puma+ x86 cores) back in 2014. The two chips belonged to the project “Skybridge” initiative and were expected to integrate identical building blocks (e.g., same graphics core, memory controller, I/O interfaces and so on) and functionality. The SoCs were designed primarily for tablets and low-cost/low-power laptops. Earlier this year chief executive of AMD already indicated that the chips would not go into production.

AMD在2014年曾正式宣布两个新的系统级芯片处理器的代号为“Amur” (阿穆尔，预计为ARMv8-A核心) “Nolan” (诺兰，预计为Puma+ x86核心) 。这两个芯片属于 “Skybridge”项目，并预计整合相同的模块（相同的图形核心，内存控制器，I/O接口和其他）和功能。这款SOC主要面向平板电脑和低成本/低功耗的笔记本。今年的前段时间，AMD的CEO（老苏）表示该芯片不会投入生产。

“I the past I talked about 20nm node that we did some designs on,” said Lisa Su, chief executive officer AMD at the company’s financial analyst day. “We have started some initial designs, we have run some silicon, but those parts are probably not going to go into production because we think we can get much more bang for the buck out of FinFET technologies going forward.”

“去年我谈过这个问题，我们在20纳米工艺上做了一些产品设计”，老苏，AMD的CEO在财务分析日上说。“我们已经开始了一些初步的设计，我们已经开始使用了一些芯片，但是那部分可能不能成为产品，因为我们认为用FinFET技术更加的划算。”

In its update for investors issued earlier this week AMD said that it would take “a one-time charge of approximately $33 million associated with a technology node transition from 20nm to FinFET.” In particular, the company will write off money it spent on design and tape-out(s) of chip(s) that will never go into production.

在本周的早些时候，AMD曾经表示将有“一次性的20纳米过渡至FinFET的3300万刀的费用”。特别的是，公司将钱花在不会成为产品的设计和样品的生产上。

AMD indicated that it has no intention to produce code-named “Amur” and “Nolan” chips (at least, in the form they are currently known) using a more advanced process technology, but said that it will use a FinFET process to manufacture other chips. A spokesperson for AMD implied that the company was developing several products, which were intended to be made using Taiwan Semiconductor Manufacturing Co.’s CLN20SOC fabrication process.

AMD表示无意用更先进的技术生产代号为 “Amur和“Nolan” 的芯片（至少形式已经知道了），但表示将会用FinFET工艺制造其他芯片。意味AMD的发言人按时，公司正在开发的几款产品可能会使用台积电的CLN20SOC工艺。

“We decided to take a product that was moving through 20nm and instead take it to FinFET,” said Drew Prairie, a corporate communications spokesman for AMD. The representative added that these were not necessarily design(s) that the company had previously publicly disclosed.

“我们打算将20纳米产品转向FinFET”AMD的发言人Drew Prairie说。代表补充说，公司此前披露的产品不一定会设计。

AMD did not reveal when it plans to roll-out its first chips to be made using GlobalFoundries’ 14nm FinFET manufacturing technology or TSMC’s 16nm FinFET fabrication process. However, it is evident that the cancellation of “Amur” and “Nolan” means that AMD will have nothing new to offer for tablets based on Microsoft Corp.’s upcoming Windows 10 in the coming months.

AMD还没有透露谁会制造第一块芯片，可能是用GlobalFoundries的14纳米 FinFET或是台积电的16纳米FinFET。然而， “Amur”和“Nolan” 的取消显然意味着在微软下月发布Windows 10前不会出新的面向平板的产品。

TSMC has designed its 20nm (CLN20SOC) manufacturing technology primarily for mobile system-on-chips. The fabrication process is tailored for low-power ARM-based application processors and lacks a number of crucial elements required to make highly-custom x86 general-purpose cores as well as advanced graphics processing units. As a result of such decision by TSMC, AMD will not produce a single chip using the CLN20SOC, whereas Nvidia will use it for only one SoC, the Tegra X1.

台积电已经设计了主要面向移动设备的20纳米(CLN20SOC)工艺。该工艺是专为低功率ARM处理器和缺少编号的定制x86内核和高级图像处理单元设计的。但是台积电做出这样的决定确实：AMD将不会生产使用CLN20SOC的芯片，Nvidia也只会用于一个SoC上——Tegra X1。

KitGuru Says: As expected, the company decided to write off money it spent on development of chips that may not be competitive and focused on development of more advanced processors. While the move makes sense, it remains to be seen how AMD plans to sustain its revenue without new products.

网站点评: 正如预期的那样，公司决定不给没有竞争力的芯片投钱，而是更专注于更先进的处理器的发展。此举虽然很有意义，但是还得观察AMD的计划，在没有新产品之前会不会有业绩收入。