三星瞄准台积电之前占有的10纳米客户

包子侯爵

Title：Samsung Aiming To Release 10 nm chips Way Before TSMC To Dominate Client List
From: http://wccftech.com/samsung-releasing-10-nm-chips-before-tsmc/

Currently, Samsung’s only nemesis in the 10 nm FinFET race happens to be TSMC and right now, the South Korean tech giant is looking pretty nervous at the fact that its Taiwanese rival will be testing mass production of 10 nm FinFET chips from next year. Samsung followed the approach of skipping from 20 nm and jumping on to 14 nm FinFET chips, and it ended up working really well in its favor because it was successfully able to secure orders from both Apple and Qualcomm. Similar to Samsung, TSMC has also jumped from 14 nm FinFET and took a direct pass on to the 10 nm FinFET bus.

最近，三星是台积电10纳米FinFET的强有力竞争对手，韩国的科技巨头现在看起来很紧张，原因是台积电明天要测试10纳米FinFET芯片样品。三星随着大潮从20纳米芯片跳到了14纳米FinFET芯片，他出色的完成了任务，因为成功地从苹果和高通那里获得了订单。类似的台积电从14纳米FinFET直接跳到了10纳米FinFET。





TSMC To Commence Risk Production Of 10 nm FinFET During Q2, 2016; What Is Samsung Planning?

台积电冒着风险在2016年第二季度开始生产10纳米FinFET。三星打算怎么办？

According to media reports hailing from Korea, TSMC will start risk production in its 10 nm FinFET processing lines during Q2, 2016. The firm plans on commencing actual producing during the second half of 2016 and in the process, plans on snaring away lucrative customers like Apple and Qualcomm away from Samsung.

根据韩国的媒体报道，台积电将会冒险在2016年第二季度开始生产10纳米FinFET。在2016年下半年计划开始正式生产，想要拉到三星的大客户——苹果和高通。

In pure terminological understanding, risk production is the final phase of testing, and is the stepping stone to raise the yield rates for full scale mass production. System semiconductors can take much longer as compared to memory semiconductors because they also have to fit in within the quality parameters of the remainder of the components such as GPUs and modems. With these 10 nm FinFET chips, application processors will definitely see their power consumption drop by 40 percent, with processor frequencies increasing by as much as 20 percent.

根据术语，风险生产是测试的最后阶段，这也是提高产率和收益的垫脚石。相比内存的半导体，系统半导体要花费更长时间，因为必须要控制其余部分的质量来适应系统半导体（像GPU和调制解调器）有了这些10纳米FinFET芯片，应用的处理功耗将会下降40%和20%的处理器频率增长。

According to the source, it is TSMC that possesses the higher probability to take mass production orders for Apple and Qualcomm than Samsung. This is because the firm has already invested $1 billion USD in 10 nm foundries. While Samsung announced in April that its 10 nm FinFET foundry is possible from the end of 2016, the company will definitely be looking to expedite the completion process. Apple and Qualcomm have yet to release their SoCs in smartphones, which will give a nice cash upgrade to Samsung.

据有关人士介绍，台电认为这很有可能会夺走三星的苹果和高通的大量订单。因为台积电已经在10纳米方面投资了10亿美元。而三星在4月宣布他们的FinFET代工厂会在2016年底完成，所以公司会加快完成该过程。苹果还尚未公布他们用于智能手机的SoC芯片，这对于增加三星的资金很好。

However, Samsung has not hinted on how it is going to speed up its production date. The company did unveil a 12 inch wafer which will be used in its 10 nm process in May, so as far as things go we are expecting the firm to strike back hard at its rival. Will Samsung be left behind by TSMC in the 10 nm FinFET race or will the South Korean giant find a way to buzz past its biggest adversary? Let us know your thoughts.

不过三星并没有按时将如何加快产品的生产日期。公司在5月没有展示12英寸的10纳米工艺晶圆，我们期待能给很难打倒的对手一个强有力的回击。在10纳米FinFET的竞争中，谁会领先？是领跑的台积电还是寻找新方法的韩国科技巨头？我们期待您的想法。